Flex PCB, Flexible Printed Circuit (FPC), Rigid-Flex PCB, Printed Circuit Board Manufacturing, PCB Assembly (PCBA).

1. Basic Structure & Dimensions Layer count: ≤64 layers Stack-up: Any-layer (12L) Max finished dimension: 620*1092mm Max finished board thickness: 4.2mm 2. Impedance Tolerance Differential impedance (>50ohm): ±7% Single-ended 50ohm impedance: ±6% 3. Layer Registration Tolerance Boards ≤12 layers: ≥3mil Boards over 12 layers: ≥4mil N+N stack-up structure: ≥4mil 4. Pattern Accuracy Board dimension over 500mm: ±5mil 5. Drilling & Copper Filling Capacity Laser blind hole spec: 65/165μm Max dimple of plated filled hole: 10μm Plating aspect ratio of through hole: 16:1 6. Back-drill Process Parameters Min back-drill diameter: 0.35mm Min stub length: 5mil Min distance from back-drill to copper: 5mil 7. Supported Special Processes Available processes: POFV, N+N structure, hybrid lamination, deep blind microvia, metallized half hole For more product parameters, please visit the official PCBMASTER website or consult the PCBMASTER customer service team.